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p . ? 2 ts z w w c o a b b g e fe a a p ty p p roduct structur e 2 014 rohm co z 22111 ? 14 ? 0 w w.rohm.com o ntroller ty p a uto m b uck - b d9035ae e neral descri p the bd903 5 with a high (vin=3.8~3 0 with one i n switching fr e range (ta=- 4 controlled b has a high e regulators e a tures ? power s u ? automati c ? 7% hig h (ta=-40 c ? pll circu 100khz~ 6 ? two-stag resistor ? various p ? undervol t constant ? aec-q1 0 p plications ? automoti v system, l p ical applica e silicon mon o o ., ltd. all rights 0 01 p e switchin g m atic a - boo s f v -c p tion 5 aefv-c is a withstand v o 0 v) capable o n ductor. the e quency for t h 4 0c~+125 c b uck-boost sy s e r efficiency c e mploying se p u pply voltage: c ally controlle h accuracy s w c ~+125c). it for external 6 00khz e overcurrent p rotection fun c t age, overvolt output monit o 0 0 qualified v e micro cont r l cd tv, pdp tion circuit o lithic integrate d reserved. g regulator w a lly c s t s w buck-boost s w o ltage and a o f generating ic has a 7 h e entire ope r c ). because o f s tem the bd 9 c ompared to p ic or h-bridg e 40v (maximu m d buck-boost w itching frequ e synchronizati protection th r c tions age output d e o r pin (pgoo d r oller, car aud tv, dvd, pc , figur e d circuit thi w ith high fr e c ont r w itchi w itching cont r wide input r a buck-boost o u % high acc u r ating temper a f the automati 9 035aefv-c regular swit c e systems. m rating) system. e ncy on: ough one ext e e tection circuit d ) i o and naviga t etc. e 2. typical a p i s product is no t 1/23 e quency, hi g r olle d ng r e r oller a nge u tput u racy a ture cally also c hing e rnal & t ion ke y pa c p plication circ u t designed for p g h accurac y d e gul a y specificati o ? input voltag e ? oscillation f ? reference v ? circuit curr e ? operating t e c kage htssop-b 2 u it diagram rotection again s tsz 0 y external f e a tor o ns e range: r equency: v oltage accur a e nt at shutdo w e mperature ra 2 4 figure 1. h t s t radioactive r a 02201-0t1 t 19.feb data e t (initial startu 100 a cy: w n: a nge: - 4 w(typ.) x d ( 7.80mm x 7. t ssop-b24 a ys t 0al00110-1 .2014 rev.0 0 data sh eet 3.8v to 30 v p is over 4.5 v khz to 600kh 0.8v 1.5 % 0 a (typ . 4 0 to +125 ( typ.) x h(ma x 60mm x 1.00 m -2 0 2 eet v v ) z % . ) x .) m m downloaded from: http:///
datasheet datasheet 2/23 tsz02201-0t1t0al00110-1-2 ? 2014 rohm co., ltd. all rights reserved. 19.feb.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD9035AEFV-C pin configuration pin description pin no. symbol function pin no. symbol function gnd ground pin 13 vcccl overcurrent detection setting pin 1 2 test test pin 14 en output on/off pin 3 vdd nchfet drive supply pin 15 vreg5 5v internal power supply pin 4 outl nchfet drive pin 16 vreg3 3.5v internal power supply pin 5 pgnd power gnd pin 17 p good power good output pin 6 n.c. not connected 18 comp error-amp output pin 7 vl pchfet gate clamp pin 19 fb feedback pin 8 n.c. not connected 20 ovplvl ov ervoltage detection setting pin 9 outh pchfet drive pin 21 ss soft start time setting pin 10 n.c. not connected 22 rt frequency setting pin 11 vcc power supply pin 23 sync external synchronization pulse input pin 12 cl overcurrent detection setting pin 2 24 clkout clock pulse output pin figure 3. pin configuration (top view) y downloaded from: http:///
datasheet datasheet 3/23 tsz02201-0t1t0al00110-1-2 ? 2014 rohm co., ltd. all rights reserved. 19.feb.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD9035AEFV-C block diagram figure 4. block diagram 0.2v 0.1v 1.6v 0.8v 0.72v 0.88v 1.25v downloaded from: http:///
datasheet datasheet 4/23 tsz02201-0t1t0al00110-1-2 ? 2014 rohm co., ltd. all rights reserved. 19.feb.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD9035AEFV-C description of blocks error amplifier (error amp) the error amplifier compares the output feedback voltage to t he 0.8v reference voltage and pr ovides the comparison result as comp voltage, which is used to determine the switching duty. becaus e at startup, the soft star t is triggered based on the soft start voltage, the comp voltage is limited by the soft start voltage. oscillator (osc) the oscillation frequency is determined by the rt resistance and the current generated by t he pin voltage. the oscillation frequency can be set in the range of 100 khz to 600 khz. slope the slope block uses the clock produced by the oscillator to generate a sawtooth wave and sends this wave to the pwm comparator. pwm_buck the pwm_buck comparator determines the switching duty by comparing the output comp voltage of the error amp, with the triangular wave of the slope block. pwm_boost the pwm_boost comparator determines the switching duty by co mparing the output voltage of t he inverting amplifier, with the triangular wave of the slope block. pgood pin 1) output overvoltage detection (ovp) the pgood pin monitors the ovplvl vo ltage and outputs h if the voltage is less than 0.88v (typ.) and outputs l if the voltage exceeds 0.88v (typ.). 2) output undervoltage detection (scp) the pgood pin monitors the output voltage (fb) and outputs h if the out put voltage exceeds 90% (typ.) and outputs l if the voltage is less than 90% (typ.). because the pgood pin is an open drain output, a pull up resistor should be connect ed when the pin is used. overcurrent protection function (ocp_l, ocp_h) the overcurrent protection has a two-stage syst em with a control method as shown below. 1) ocp low level operations in case the inter vccl-cl pin voltage exceeds 100mv (typ.) the chip goes into ocp low level operations and the outh and outl pin pulses are limited. also, in case this pul se limitation status continue s for 256clk in a situation where the fb pin voltage drops below the undervoltage detection voltage vlow, the soft start pin capacitor is discharged and the output is turned off for 8192clk. during the 8192clk in which the output is turned off the logic of outh and outl pin changes as follows; outh=h and outl=h. after the 8192clk the chip returns to norma l operations and the soft start pin is recharged. 2) ocp high level operations in case the inter vccl-cl pin voltage exceeds 200mv (typ.), the chip goes into ocp high level operations, the soft start pin capacitor is discharged and the output is turned off for 8192clk. duri ng the 8192clk in wh ich the output is turned off the logic of outh and outl pin changes as follows; outh=h and outl=h. after the 8192clk the chip returns to normal operations and the soft start pin is recharged. figure 5. timing chart of two-stage overcurrent protection operations downloaded from: http:///
datasheet datasheet 5/23 tsz02201-0t1t0al00110-1-2 ? 2014 rohm co., ltd. all rights reserved. 19.feb.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD9035AEFV-C overvoltage protection function (ovph) in case the ovplvl pin voltage exceeds 1.25v (typ.), the so ft start pin capacitor is dischar ged and the output is turned off for 8192clk. during the 8192clk in which the output is turned off the logic of outh and outl pin changes as follows; outh=h and outl=h. after the 8192clk the chip returns to normal operations and the soft start pin is recharged. figure 6. overvoltage protection timing chart soft start the soft start block provides a function to prevent the overshoot of the output voltage vo th rough gradually increasing the normal rotation input of the error amplifier when power supply turns on to gradually increase the switching duty. the soft start time is set by the charge capacity of the soft start pin capacitor. (refer to p. 17) low voltage lockout circuit (uvlo) this is a low voltage error prevention circuit. this prevents internal circuit error during increase of power supply voltage and during decline of power supply voltage. if the vcc drops below 3.4v (typ.), the uvlo is activated and the circuit is shut down. thermal protection circuit (tsd) in order to prevent thermal destruction/thermal runaway of th is ic, the tsd block will turn off the output when the chip temperature reaches approximately 150 or more. when the chip temperature fa lls to a specified level from thermal shutdown detection, the output will reset. however, since the tsd is designed to protect the ic, the margin for thermal design must be provided to guarantee t hat the chip junction temperature should be less than 150c, which is the thermal shutdown detection temperature. downloaded from: http:///
datasheet datasheet 6/23 tsz02201-0t1t0al00110-1-2 ? 2014 rohm co., ltd. all rights reserved. 19.feb.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD9035AEFV-C absolute maximum ratings parameter symbol limits unit vcc voltage vcc 40 *1 v en voltage en vcc v vcccl voltage vcccl vcc v cl voltage vcl vcccl v inter vcc-vl voltage vcc-vl 13 v vdd voltage vdd vcc or 7 (whichever is lower) v vreg3 voltage vreg3 vcc or 7 (whichever is lower) v vreg5 voltage vreg5 vcc or 7 (whichever is lower) v ss voltage ss vreg3 v fb voltage fb vreg3 v ovplvl voltage ovplvl vreg3 v comp voltage comp vreg3 v sync voltage sync vreg3 v pgood voltage pgood vreg3 v power dissipation *2 pd 4.00 w operating temperature range topr -40 +125 oc storage temperature range tstg -55 +150 oc junction temperature tjmax 150 oc *1 pd and aso should not be exceeded. *2 if mounted on a standard rohm 4 layer pcb (copper foil area: 70x70mm) (standard rohm pcb size: 70x70x1.6mm) reduce by 32mw for every 1 increase. (above 25 ) recommended operating rating (ta=-40 125 ) parameter symbol maximum ratings unit min. max. voltage power supply vcc 3.8 *3 30 v oscillation frequency fosc 100 600 khz external synchronization frequency fsync 100 600 khz *3 initial startup is over 4.5v downloaded from: http:///
datasheet datasheet 7/23 tsz02201-0t1t0al00110-1-2 ? 2014 rohm co., ltd. all rights reserved. 19.feb.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD9035AEFV-C electrical characteristic (unless otherwise specified: ta=-40~125c, vcc=12v, en=5v) parameter symbol limits unit condition min. typ. max. circuit current circuit current ivcc - 7 15 ma circuit current at shutdown ist - 0 10 a en=0v en en pin on threshold voltage venon 2.5 - - v en pin off threshold voltage venoff - - 0.5 v en pull down resistance ren 188 375 750 k ? vreg3 vreg3 output voltage vvreg3 3.3 3.5 3.7 v vreg5 vreg5 output voltage vvreg5 4.5 5.0 5.4 v uvlo uvlo_vcc detection voltage vuvlo 3.1 3.4 3.7 v uvlo hysteresis voltage vuvlohys 0.4 0.6 0.8 v error amp fb input bias current ifb - 0 - a fb=vfb2 reference voltage 1 vfb1 0.792 0.800 0.808 v ta=25 oc reference voltage 2 vfb2 0.788 0.800 0.812 v ta=-40 oc +105 oc soft start soft start charge current iss 5 10 15 a ss=0.1v oscillator oscillation frequency fosc 326 350 375 khz rt=33k ? external synchronization frequency fsync - 350 - khz sync=350khz sync threshold voltage vsync 0.5 1.8 2.5 v sync pull down resistance rsync 125 250 500 k ? sync=3v sync input maximum on duty donmax 80 - - % sync input minimum on duty donmin - - 20 % downloaded from: http:///
datasheet datasheet 8/23 tsz02201-0t1t0al00110-1-2 ? 2014 rohm co., ltd. all rights reserved. 19.feb.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD9035AEFV-C parameter symbol limits unit condition min. typ. max. driver outh pin upper on resistance ronhh - 1.7 - ? outh pin lower on resistance ronhl - 3 - ? outl pin upper on resistance ronlh - 24 - ? outl pin lower on resistance ronll - 22 - ? boost max duty 1 dbstmax1 - 92 - % f=600khz boost max duty 2 dbstmax2 60 - - % vcc=3.8v ocp overcurrent detection cl pin voltage 1 vcl1 86 100 114 mv inter vcc-vl voltage overcurrent detection cl pin voltage 2 vcl2 172 200 228 mv inter vcc-vl voltage pgood pgood pin on resistance rpg - 0.1 0.4 k ? pgood=0.15v,fb=0v pgood pin leak current ipg - 0 1 a pgood=3.3v,fb=0.8v, ta=-40~+105 oc output overvoltage detection voltage vover 0.85 0.88 0.91 v ovplvl voltage output undervoltage detection voltage vlow 0.70 0.72 0.74 v fb voltage downloaded from: http:///
datasheet datasheet 9/23 tsz02201-0t1t0al00110-1-2 ? 2014 rohm co., ltd. all rights reserved. 19.feb.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD9035AEFV-C typical performance curves (unless otherwise specified: ta=25c) 0.6 0.7 0.8 0.9 1.0 -40-20 0 20406080100 reference voltage [v] ambient temperature : ta[ ] 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 -40 -20 0 20 40 60 80 100 ambient temperature : ta[ ] circuit current [ma] figure 7. efficiency (vo=6v, fosc=350 khz) figure 8. circuit current at shutdown vs. temperature characteristics figure 9. circuit current vs. temperature characteristics figure 10. reference voltage vs. temperature characteristics 50 55 60 65 70 75 80 85 90 95 0.0 0.5 1.0 1.5 2.0 efficiency [%] load current [a] vcc=3.8v vcc=6v vcc=12v 0 1 2 3 4 5 6 7 8 9 10 -40-20 0 20406080100120 : [ ] : a[] f=350khz vo=6v downloaded from: http:///
datasheet datasheet 10/23 tsz02201-0t1t0al00110-1-2 ? 2014 rohm co., ltd. all rights reserved. 19.feb.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD9035AEFV-C typical performance curves (unless otherwise specified: ta=25c) 340 341 342 343 344 345 346 347 348 349 350 -40 -20 0 20 40 60 80 100 osilating frequency : fosc [khz] : a[ ] 9.0 9.2 9.4 9.6 9.8 10.0 10.2 10.4 10.6 10.8 11.0 -40-20 0 20406080100 charge current : iss [ a] ambient temperature : ta[] 3.4 3.5 3.6 3.7 3.8 3.9 4.0 4.1 4.2 4.3 -40 -20 0 20 40 60 80 100 120 uvlo threshold voltage [v] : a[] detection voltage(vuvlo) return voltage figure 11. overcurrent detection cl pin voltage vs. temperature characteristics figure 12. oscillating frequency vs. temperature characteristics figure 13. soft start charge current vs. temperature characteristics figure 14. uvlo detection/return voltage vs. temperature characteristics rt=33k 0 50 100 150 200 250 -40 -20 0 20 40 60 80 100 ambient temperature : ta[ ] inter vccl-cl pin voltage [mv] downloaded from: http:///
datasheet datasheet 11/23 tsz02201-0t1t0al00110-1-2 ? 2014 rohm co., ltd. all rights reserved. 19.feb.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD9035AEFV-C 1.70 1.75 1.80 1.85 1.90 1.95 2.00 2.05 2.10 -40-20 0 20406080100 en threshold voltage : ven [v] ambient temperature : ta[] 0.0 0.2 0.4 0.6 0.8 1.0 1.2 -40 -20 0 20 40 60 80 100 fb pin bias current : ifb [ a] ambient temperature : ta[] 0.00 0.02 0.04 0.06 0.08 0.10 0.12 0.14 0.16 0.18 0.20 -40-20 0 20406080100 pgood on resistance : prg [k] ambient temperature : ta[] 0.70 0.75 0.80 0.85 0.90 -40 -20 0 20 40 60 80 100 120 output over / low sense voltage [v] : a[] vover vlow figure 15. en threshold voltage vs. temperature characteristics figure 16. fb pin bias current vs. temperature characteristics figure 17. pgood pin on resistance vs. temperature characteristics figure 18. output overvoltage / undervoltage detection voltage vs. temperature characteristics fb=0v downloaded from: http:///
datasheet datasheet 12/23 tsz02201-0t1t0al00110-1-2 ? 2014 rohm co., ltd. all rights reserved. 19.feb.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD9035AEFV-C application example n.b. there are many factors (pcb, output current, etc.) that can affect the dcdc characteristics. please verify and confirm using practical applications. n.b. no connection (n.c) pin should not be connected to any other lines. n.b. be sure to connect the test pin to ground. n.b. in case the external synchronization function is not used, be sure to connect sync pin to ground. n.b. this ic is not designed to operate as boost or buck appl ication with single mosfet. be sure to use both m1 & m2. n.b. if en pin is connected to vcc pin, please insert ren 150k between the pins. directions for pattern layout of pcb 1) design the wirings shown by heavy lines as short as possible. 2) place the input ceramic capacitor cvcca, cvccb as close to the m1 as possible. 3) place the rrt as close to the gnd pin as possible. 4) place the rfba and rfbb as close to the fb pin as pos sible and provide the shortest wiring from the fb pin. 5) place the rova and rovb as close to t he ovplvl pin as possible and provide the shortest wiring from the ovplvl pin. 6) place the rfba, rfbb, rova, and rovb as far away from the l as possible. 7) separate power gnd and signal gnd so that sw noise doesnt affect the signal gnd. an example of parts values in case of vcc=3.8 30v, vo=5v, io=0 3a, 350khz parts no. value parts no. value da rb225ns-40 l1 10 (tdk slf series) db rb225ns-40 cvo 100 (16v) m1 rsj250p10 rco 2.2k m2 rsj450n04 rfba 15.6k rcl 13.33m rfbb 82k ren 150k rfbc 330 rrt 33k rova 15.6k rpgd 47k rovb 82k cvdd 1 (10v) ccoa 0.015 (10v) cvl 0.1 (50v) ccob 100p (10v) cvcca 2.2 (50v) cfb 680p (10v) cvccb 220 (50v) cvreg3 0.47 (10v) cvreg5 0.47 (10v) css 0.047 (10v) y downloaded from: http:///
datasheet datasheet 13/23 tsz02201-0t1t0al00110-1-2 ? 2014 rohm co., ltd. all rights reserved. 19.feb.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD9035AEFV-C the control of automatic buck-boost system the following shows the switchin g state of three control modes. (1) buck mode (vcc>>vo) in case the input voltage is high comp ared to the output voltage, the chip will go into buck mode, resulting outh to repeatedly switch between h and l and that the outl will go to l (= off). this operation is the same as that of standard step-down switching regulators. below, the outh and outl waveforms are shown. vcc dpon = vo (eq.1) (2) buck-boost mode (vcc P vo) in case the input voltage is close to t he output voltage, the chip will go into bu ck-boost mode, resulting both the outh and outl to repeatedly switch between h and l. concerning the outh, outl timing, the chip internally controls where the following sequence is upheld; when outh: h ? l, outl: h ? l. shown below are the outh and outl waveforms. the timing excludes the sw delay the relationship between on duty of pmos (dpon), on duty of nmos (dnon), vcc and vo is shown in the following equation. vcc dpon / (1-dnon) = vo (eq.2) the formula for calculation of dpon and dnon are shown in p.15. (3) boost mode (vcc< vo figure 21. figure 20. figure 19. figure 22. downloaded from: http:///
datasheet datasheet 14/23 tsz02201-0t1t0al00110-1-2 ? 2014 rohm co., ltd. all rights reserved. 19.feb.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD9035AEFV-C (4) mode transfer voltage and duty control vo, the gain of the inverting amplifier and the cross duty de termines the transfer voltage at buck to buck-boost mode and buck-boost to boost mode. the general description is shown below. the duty of outh is controlled by outpu t of error amp (comp) and slope voltage. also, outl duty is controlled by the outpu t voltage of the inverting amplifier in chip (boostcomp) and slope voltage. in case vcc = vo, because comp voltage becomes equa l to boostcomp voltage, outh and outl switch simultaneously. on duty of pmos in this condition is called the cross duty (dx = 0.85, typ.). dpon and dn on can be calculated by the following equation, assuming the gain of t he inverting amplifier as a (1.5, typ.). dnon = 1 C dx + a (dpon C dx) (eq.4) dnon = 1.5dpon C 1.125 ( ) from eq.3, eq.4 and dpon=1, the input volt age at transition between buck-boost and boost mode is calculated by following; vcc = {dx C a (1 C dx)} vo vcc = 0.625 vo ( ) also, from eq.1, eq.4 and dnon=1, the input voltage at tran sition between buck-boost and buck mode is calculated by following; vcc = vo a / {(1 + a)dx C 1} vcc = 1.333 vo ( ) in case of a=1.5(typ.) and dx=0.85(typ.) be sure to confirm dx and a values under the actual application because these parameters vary depending on conditions of use and parts. dx varies with oscillating frequency shown in fig.24. in addition, a value can be calculated by dnon/ dpon. 81 82 83 84 85 86 87 88 0 100 200 300 400 500 600 700 800 duty [%] k [khz] pmos: rsd080p05 nmos: rsd150n06 boostcomp comp buck-boost boost buck cross duty 0% 85%(typ.) 100% slope vcc=vo (typ.) figure 23. buck-boost operation controlled by comp, boostcomp and slope voltage figure 24. cross duty vs. frequency characteristics cross duty [%] frequency [khz] downloaded from: http:///
datasheet datasheet 15/23 tsz02201-0t1t0al00110-1-2 ? 2014 rohm co., ltd. all rights reserved. 19.feb.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD9035AEFV-C selection of components externally connected (1)setting the output l value the coil value significantly influences the output ripple curren t. thus, as seen in bellow, the larger the coil, and the higher the switching frequency, the lower the drop in ripple current. the optimal output ripple current setting is 30% of maximum current. buck mode buck-boost mode boost mode vcc > vo vcc < vo i l ripple current, i _ l average coil current, f oscillating frequency dpon pmos on duty = vo dx (1+a) / (vcc+a vo) =2.13 vo / (vcc+1.5 vo) (typ.) dnoff nmos on duty = (1+a) dx C a dpon =2.13 C 1.5 dpon (typ.) an output current in excess of the coil current rating will caus e magnetic saturation to the coil and decrease efficiency. the following equation shows the peak current i lmax assuming the efficiency as . it is recommended to provide a sufficient margin to ensure that the peak current does not exceed the coil current rating. use low resistance (dcr, acr) coils to minimize coil loss and increase efficiency. (2)setting the output co value select output capacitor with cons ideration to the ripple voltage ( vp-p) tolerance. the following equation is used to determine the output ripple voltage. buck mode boost mode the output co setting needs to be kept with in the allowable ripple voltage range. allow for a sufficient voltage output marg in in establishing the capacitor rating. low esr capacitors provide a lower output ripple voltage. because the out put startup time needs to be set within the soft start time, please take the conditions described in the flowing equation also in considerati on when selecting the value of the output capacitor. tss (ilimit C io) tss soft start time co Q vo ilimit over current detection value n.b. non-optimal capacitance values ma y cause startup problems. especially in cases of extremely large capacitance values, the possibility exists that the inru sh current at startup will activate the ov ercurrent protection, thus not starting t he output. therefore, verification and conformation with the actual application is recommended. ? ? ? ? ? ? + = 2 ? 1 l lmax l downloaded from: http:///
datasheet datasheet 16/23 tsz02201-0t1t0al00110-1-2 ? 2014 rohm co., ltd. all rights reserved. 19.feb.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD9035AEFV-C vo rfbb rfba 0.8v fb (3)setting the input capacitor (cin) the input capacitor serves to lower the output impedance of the power source connected to the input pin (vcc, vcccl). increased power supply output imped ance can cause input voltage (vcc) instability and may negatively impact oscillation and ripple rejection characteristics. therefore, it is necessa ry to place the input capacitor in close proximity to the mosfet and pgnd pin. select a low-esr capacitor with little change in capacitance due to temperature change and with a sufficiently large ripple current. the ripple current irms is determined by the following equation: also, be certain to ascertain the operating temperature, load range and mosfet conditions for the application in which the capacitor will be used, since capacitor performance is heavily de pendent on the applications input power characteristics, substrate wi ring and mosfet gate drain capacity. (4)setting the output voltage the output voltage is determined by the equation below. select a combination of r1 and r2 to obtain the required voltage. note that a small resistance value leads to a drop in power efficiency and that a large resistance value leads, due to the erro r amp output drain current to an in crease of the offset voltage. (5)setting the oscillation frequency the internal oscillation frequency setting is possible with th e corresponding value of resistor connected to rt pin. the setting range is 100khz to 600khz. the correlation between the resistance value and the oscillation frequency is shown in the table below. settings outside of this range can lead to a switching stop and consequentially operat ions cannot be guaranteed. rt resistance oscillation frequency 18.7k 20k 22.5 k 24k 27k 28.5k 30k 33k 47k 62k 91k 120k 600khz 550khz 500khz 470khz 424khz 400khz 384khz 350khz 250khz 192khz 133khz 100khz vo = 0.8 rfba + rfbb rfba figure 27. rt resistance vs. oscillation frequency 0 100 200 300 400 500 600 700 0 2 04 06 08 01 0 01 2 01 4 0 y[kz] [k] figure 26. i figure 25. vo vcc - vo vcc irms = io [a] downloaded from: http:///
? 2 w w ts z b d (6) (7) (8) 2 014 rohm co w w.rohm.com z 22111 ? 15 ? 0 d 9035ae f setting the s o the soft sta shows the r e of the figur e f capacitanc e the output d application i other powe r mosfet sel e ? pchm o v d s o v g s n.b. t o all o n.b. a reco m n.b s a hig h ? nch m o v d s o v g s o all o n.b. a reco m n.b s a hig h schottky barr i ? reve r ? allow a n.b. a reco m n.b. s recov e o ., ltd. all rights 0 01 fv -c o ft start time rt function is n e lation betwe e e . f igure 28. so f e values bet w d ue to the p h is recommen d r sources. e ction os used for s s maximum r a s maximum r a t he voltage b e o wable curre n a value above m mended. s electing a lo w h efficiency. m os used for s s maximum r a s maximum r a o wable curre n a value above m mended. s electing a lo w h efficiency. i er diode sele c r se voltage v r a ble current > a value above m mended. s electing a di o e ry is conduc i reserved. n ecessary to p e n soft start d e f t start capaci w een 0.01 f a h ase constan t d ed. use hig h s tep-down fe t a ting > v cc a ting > lower e tween vcc- v n t > coil peak the overcurr e w on resistan c s tep-up fet a ting > v o a ting > v dd n t > coil peak the overcurr e w on resistan c c tion r > vcc > coil peak cu r the overcurr e o de with a lo w i ve to achievi n p revent inrush e lay time and tance vs. del a a nd 0.1 f are t , output cap a h accuracy co t v alue of 13v o v l is kept at 1 0 current i lmax e nt protection s c e is conduci v current i lmax e nt protection s c e is conduci v r rent i lmax e nt protection s w forward volt a n g a high effic i 17/23 of coil curren t capacitance, a y time recommend e a citance, etc. o mponents (e. o r vcc 0 .3v(typ.), 1 3 setting is v e to achievin g setting is v e to achievin g setting is a ge and fast iency. t and output v o which can be 0. 8 tss = is s e d. there is a therefore, v g. x5r) whe n 3 v(max.). g g figure 2 9 tsz 0 o ltage oversh o calculated b y 8 [v] (typ.) c s [ a] (typ. 1 possibility th a erification an d n implementin g . soft start ti m 02201-0t1 t 19.feb o ot at startup. y using the eq u c ss [ f] [sec] 1 0 a) a t an oversho o d confirmatio n g sequential s m e tss figure 3 0 figure 3 datash e datasheet t 0al00110-1 .2014 rev.0 0 the figure b e u ation to the r o t is generate n with the a c s tartups invol v 0 1 e et datasheet -2 0 2 e low ight d in c tual v ing downloaded from: http:///
datasheet datasheet 18/23 tsz02201-0t1t0al00110-1-2 ? 2014 rohm co., ltd. all rights reserved. 19.feb.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD9035AEFV-C (9) setting the phase compensation the phase compensation is set by the capacitors and resistors connected in parallel to comp and fb pin, and rfbb. at first, it is easier to achieve stability at any power supply and load condition by adjusting values at the lowest voltage power supply and maximum load. non-optimum values can cause unstable output, like oscillation. assuming rfbb>>rfbc and ccoa>>ccob , each phase compensation elements make phase delay fp1and fp2, phase lead fz1 and fz2, which can be determined by the formulas below . this setting is obtained by using a simp lified calculation; theref ore, adjustment on t he actual application may be required. also as these characteristics are influenced by the substrate layout, load conditions, etc., verification and confirmation with the actual application at time of mass production design is recommended. (10)switching pulse jitter and split depending on the type of external fet and diode there may be jitter and split in the switching pulse. in case this jitter and split becomes a problem please use the following countermeasures. ? add a resistor to the outh gate of the step-down fet. ? add a resistor to the outl gate of the step-up fet. however, as these characteristics are influenced by the substrate pattern, used fet, etc., verification and confirmation with the actual application is recommended. (11)measurement of the open loop of the dc/dc converter to measure the open loop of the dc/dc converter, use t he gain phase analyzer or fra to measure the frequency characteristics. 1. check to ensure output causes no oscillation at the maximum load in closed loop. 2. isolate and and insert vm (with amplitude of approximately. 100mvpp). 3. measure (probe) the oscillation of to that of . thermal derating characteristics 70mm70mm1.6mm, occupied copper foil is less than 3%, glass epoxy substrate, the board and the back exposure heat radiation board part of package are connected with solder. 1 layer board (copper foil 0mm 0mm) ja 113.6 /w 2 layer board (copper foil 15mm 15mm) ja 73.5 /w 2 layer board (copper foil 70mm 70mm) ja 44.6 /w 4 layer board (copper foil 70mm 70mm) ja 31.3 /w caut ion: pd depends on number of the pcb layer and area. this value is measurement value, but not guaranteed value. fp1 = 1 2 cfbrfbc fp2 = 1 2 ccobrco fz1 = 1 2 cfbrfbb fz2 = 1 2 ccoarco r l dc/dc converter controller + v o vm + figure 33. 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 0 25 50 75 100 125 150 175 a mbient tempera ture : ta [ ] power dissipation: pd [w ] 4.00w 2.80w 1.70w 1.10w figure 34. thermal derating characteristics figure 32. downloaded from: http:///
datasheet datasheet 19/23 tsz02201-0t1t0al00110-1-2 ? 2014 rohm co., ltd. all rights reserved. 19.feb.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD9035AEFV-C i/o equivalence circuits k downloaded from: http:///
datasheet datasheet 20/23 tsz02201-0t1t0al00110-1-2 ? 2014 rohm co., ltd. all rights reserved. 19.feb.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD9035AEFV-C operational notes 1) absolute maximum ratings exceeding the absolute maximum rating for supply voltage, operating temperature or other parameters can result in damages to or destruction of the chip. in this event it also becomes impossible to determine the cause of the damage (e.g. short circuit, open circuit, etc.). therefore, if any special mode is being considered with values expected to exceed the absolute maximum ratings, implementing physical safety measures, such as adding fuses, should be considered. 2) gnd electric potential keep the gnd terminal potential at the lowest (mi nimum) potential under any operating condition. 3) thermal design use a thermal design that allows for a sufficient margin wi th regard to the power dissip ation of the ac tual operating situation. 4) inter-pin shorting and mounting errors ensure that when mounting the ic on the pcb the directio n and position are correct. incorrect mounting may result in damaging the ic. also, shorts caused by dust entering betw een the output, input and gnd pin may result in damaging the ic. 5) operation in strong electromagnetic fields use caution when operating in the presence of strong electromagnetic fields, as this may cause the ic to malfunction. 6) common impedance with regard to the wiring of the power supply and of the ground, take sufficient care to decrease the common impedance and to make the ripple as small as possible (by making the wiring as wide and short as possible, reducing ripple by l, c, etc.). 7) thermal shutdown (tsd) temperature protect circuit (tsd circuit) is built-in in this ic. as for the tem perature protect circu it (tsd circuit), because it a circuit that aims to block the ic from insistent careless runs, it is not aimed for protection and guarantee of ic. therefore, please do not assume the continuing use af ter operation of this circuit and the temperature protect circuit operation. 8) rush current at power on with cmos ics and ics featuring multiple power supplies t he possibility exists of an instantaneous current rush when the power is turned on. therefore, att ention should be given to the power coupling capacitance and power and ground wiring width and route. 9) power input at shutdown if vcc starts up rapidly at shutdown (en=off), vreg3 voltage may be output and this may cause the ic to malfunction. therefore, set the rise time of vcc to under 40v/ms. 10) about ic pin input this monolithic ic contains p+ isolat ion and p substrate layers between adj acent elements in order to keep them isolated. p-n junctions are formed at the intersection of these p layers with t he n layers of other elements, creating a parasitic diode or transistor. relations between each potenti al may form as shown in the example below, where a resistor and transistor are connected to a pin: z with the resistor, when gnd> pin a, and wi th the transistor (npn), when gnd>pin b: the p-n junction operates as a parasitic diode. z with the transistor (npn), when gnd> pin b: the p-n junction operates as a parasitic transistor by interacting with t he n layers of elements in proximity to the parasitic diode described above. parasitic diodes inevitably occur in the structure of the ic. their operation can result in mutual interference between circuits and can cause malfunctions and, in turn, physical da mage to or destruction of the chip. therefore do not employ any method in which parasitic diodes can operate such as app lying a voltage to an input pin that is lower than the (p substrate) gnd f igure 35. n p + (pin a) resistor parasitic element p p + gnd p n (pin b) transistor (npn) p + p + n n p-substrate gnd n p c e b parasitic element gnd c b parasitic element (pin b) e (pin a) parasitic element downloaded from: http:///
datasheet datasheet 21/23 tsz02201-0t1t0al00110-1-2 ? 2014 rohm co., ltd. all rights reserved. 19.feb.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD9035AEFV-C 11) about test pin note that the test pin will go into test mode that masks protection functions wh en supplied with voltage. be sure to connect test pin to ground. 12) about vreg3, vreg5 pin vreg3 and vreg5 output pins are designed to supply power only into this ic. thus, it is not recommended to use them for other purposes. ordering information b d 9 0 3 5 a e f v - c e 2 parts number package efv: htssop-b24 product rank c: for automotive packaging specification e2: embossed tape and reel marking diagram htssop-b24 (top view) bd9035a part number marking lot number 1pin mark downloaded from: http:///
? 2 w w ts z b d ph p 2 014 rohm co w w.rohm.com z 22111 ? 15 ? 0 d 9035ae f ysical dime n p ackage n a o ., ltd. all rights 0 01 fv -c n sion, tape a n a me < ta tq d o reserved. n d reel info r ta pe and ree l in em b t ape q uantity d irection o f feed t he r ee 20 00 e2 ( r ee r mation ? o rde l in formation> b ossed carrier ta pe he direction is the 1p ee l on the left hand a 00 pcs ee l 1pin 22/23 h t rde r quantity needs to b pe (with dry pack ) 1p in of product is a t t a nd you pull out t he t ssop-b2 4 to be multiple of the min ) t the upper left when he tape on the right h direction o tsz 0 4 min imum quantity. en you hold t h and ) n o f feed 02201-0t1 t 19.feb datash e datasheet t 0al00110-1 .2014 rev.0 0 e et datasheet -2 0 2 downloaded from: http:///
datasheet datasheet 23/23 tsz02201-0t1t0al00110-1-2 ? 2014 rohm co., ltd. all rights reserved. 19.feb.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD9035AEFV-C revision history date revision change log 2013.7.30 001 new version created. 2014.2.19 002 added the term about aec-q100. (p.1) replaced physical dimension, tape and reel information with new format. (p.22) downloaded from: http:///
datasheet d a t a s h e e t notice-paa-e rev.001 ? 2015 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sales representative in advance. unless otherwise agreed in writ ing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any rohms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms products under an y special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice-paa-e rev.001 ? 2015 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the co mbination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the informati on contained in this document. pr ovided, however, that rohm will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the produc ts, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 201 5 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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